About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

What You Can Expect

In this role you will be part of adevelopmentteam and responsible for all aspects of engineering design, process development, and productization for Marvell's optics product line. Responsibilities include

• Develop photonics IC (PIC) and electronics IC (EIC) co-design flow.
• Define PIC and EIC IO pad frame and 2.5D interposer floor plan.
• Lead PIC and EIC interconnect schematic and layout design process.
• Define PIC and EIC hybrid integration packaging design rules, process flow, and material sets.
• Lead optical package development to establish package manufacturability and reliability.
• Collaborate with cross-functional teams consisting of Digital and Analog Circuit designers, Signal/Power Integrity, and substrate layout, and system design team.
• Drive optical product package qualification activities from initial concept to production.

What We're Looking For

Bachelor's degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience. Master's degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.

General Requirements

• Familiarity or direct development or production experience in designing hybrid multi-chip integration using 2.5D/3D packaging.
• Direct experiencein device or package characterization andtesting as required in the development environment.High speed testing background is preferred.
• A strong understanding of wafer level packaging process flow.
• Direct experience in collaborating with major OSAT for developing advanced packaging technology for high-speed optics and/or electronics IC is a plus.
• Ability to work with a large body of data and the necessary statistical analysis tools, and the ability to present the data and ideas to a diverse audience.
• Effective communication and presentation
• Team player. Expected to work with cross-functional team.

Desired Personal Characteristics

• Hands-on, roll-up-the-sleeves personality. Able and interested in the basics and the high strategic level, and everything in between. Not afraid to get hands dirty, and easily able to transition from soup to nuts.
• Action-Oriented. A proactive self-starter with an exceptional degree of confidence and commitment who does not require constant nudging to move programs forward or effectively complete their execution. High quality performance-oriented.
• Flexibility. Responsibility changes from time to time depending on the priority of the team and company. The person is expected to catch up with the new responsibility quickly and execute.
• Effective team player. Able to collaborate cross-functionally and globally.

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Expected Base Pay Range (USD)

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at .